JPH0623012Y2 - プリント配線板 - Google Patents
プリント配線板Info
- Publication number
- JPH0623012Y2 JPH0623012Y2 JP1989115001U JP11500189U JPH0623012Y2 JP H0623012 Y2 JPH0623012 Y2 JP H0623012Y2 JP 1989115001 U JP1989115001 U JP 1989115001U JP 11500189 U JP11500189 U JP 11500189U JP H0623012 Y2 JPH0623012 Y2 JP H0623012Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pattern
- detection
- deviation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989115001U JPH0623012Y2 (ja) | 1989-09-29 | 1989-09-29 | プリント配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989115001U JPH0623012Y2 (ja) | 1989-09-29 | 1989-09-29 | プリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0353862U JPH0353862U (en]) | 1991-05-24 |
JPH0623012Y2 true JPH0623012Y2 (ja) | 1994-06-15 |
Family
ID=31663347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989115001U Expired - Lifetime JPH0623012Y2 (ja) | 1989-09-29 | 1989-09-29 | プリント配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0623012Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2812976C2 (de) * | 1978-03-23 | 1980-03-06 | Erich Ing.(Grad.) 3003 Ronnenberg Luther | Verfahren zur Feststellung des Versatzes zwischen Leiterbahnen und Kontaktlöchern bei einer Leiterplatte sowie eine Leiterplatte zur Verwendung in diesem Verfahren |
-
1989
- 1989-09-29 JP JP1989115001U patent/JPH0623012Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0353862U (en]) | 1991-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |